What is Amkor Technology, Inc. (AMKR)?

Amkor Technology, Inc. (AMKR) is a stock in the Technology sector, Semiconductors industry. View full analysis on Stocks360.

What is the current price of AMKR?

The current price of AMKR is $39.94. Prices are updated in real time on Stocks360.

What is AMKR's price-to-earnings (PE) ratio?

AMKR's trailing twelve-month PE ratio is 15.98, based on current price and earnings per share data available on Stocks360.

What is AMKR's market capitalization?

AMKR's market capitalization is $9,923,172,880.00, placing it in the mid-cap tier.

Does AMKR pay a dividend?

Yes. AMKR has a trailing twelve-month dividend yield of 0.01%. Dividend data is sourced from financial market providers and displayed on Stocks360.

Amkor Technology, Inc. (AMKR)

Stock analysis · NASDAQ · Technology · Semiconductors

$39.94

Market Cap

$9.92B

PE (TTM)

15.98

EPS (TTM)

N/A

Dividend Yield

0.84%

Beta

2.22

Day Range

$37.36 – $40.05

52-wk Range

$29.50 – $96.68

Avg Volume

N/A

Volume

12.66M

Amkor Technology, Inc. (AMKR) is a publicly traded company in the Technology sector. Latest price: $39.94. Market cap $9.92B. Trailing PE 15.98. Dividend yield 0.84%. Sign in to Stocks360 for full DCF valuation, fundamentals, technicals, and AI-driven analysis.

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1-Year Price

2025-10-28 · $32.16 2026-10-27 · $39.94 (+24.19%)

Earnings

Most Recent

Oct 26, 2026

EPS $0.76 vs est. $0.78

Missed by $0.02

Next Earnings

Feb 8, 2027

EPS estimate $0.77

Proprietary Signals

Signal snapshot temporarily unavailable.

About Amkor Technology, Inc.

Amkor Technology, Inc. operates internationally, delivering external semiconductor packaging and testing solutions across North America, Japan, Europe, the Middle East, Africa, and the broader Asia Pacific region. Their comprehensive, end-to-end offerings encompass a range of processes, including semiconductor wafer bumping, probing, back-grinding, package conceptualization, final packaging, testing, and direct shipment services. The company's product portfolio features flip-chip scale packages, critical for devices like smartphones, tablets, and other portable consumer electronics. They also provide flip-chip stacked chip-scale packages, designed for layering memory atop digital basebands and as application processors in mobile units. Flip-chip ball grid array packages cater to diverse applications in networking, data storage, computing, and general consumer products. Wafer-level CSP packages find use in power management systems, transceivers, sensors, wireless charging technologies, codecs, radar systems, and specialized silicon components. Their wafer-level fan-out packages are integral for integrated circuits, alongside silicon wafer integrated fan-out technology, which offers…

Valuation

Trailing twelve months. Multiples relative to current market price.
P/E (TTM)	15.98×
P/S (TTM)	1.33×
P/B	2.06×
PEG	0.16×
P/FCF (TTM)	18.64×
EV / EBITDA	7.31×
EV / Sales	1.46×
Earnings Yield	6.25%
Free Cash Flow Yield	5.36%
Dividend Yield	0.84%

Fundamentals

Trailing twelve months. Source: financial statements via market data.
Enterprise Value	$10.87B
Revenue (TTM)	$7.46B
Net Income (TTM)	$620.57M
Free Cash Flow (TTM)	$596.43M
Net Debt	$947.72M
Working Capital	$2.49B
Gross Margin	16.56%
Operating Margin	9.51%
Net Margin	8.30%
Return on Equity	13.43%
Return on Invested Capital	7.69%